
Position : Home > Product > Intel Xeon Processor > Intel Xeon Gold
Details
General information | |
Type | CPU / Microprocessor |
Market segment | Server |
Family | Intel Xeon Gold |
Model number | 5117 |
CPU part number | CD8067303317801 is an OEM/tray microprocessor |
Frequency | 2000 MHz |
Maximum turbo frequency | 2800 MHz |
Clock multiplier | 20 |
Package | 3647-land Flip-Chip Land Grid Array (FC-LGA) |
Socket | Socket 3647 / P0 / LGA3647-0 |
Size | 2.99" x 2.22" / 7.6cm x 5.65cm |
Introduction date | 42927 |
S-spec numbers | |
Part number | Production processors |
SR37S | |
CD8067303317801 | + |
Architecture / Microarchitecture | |
Microarchitecture | Skylake |
Platform | Purley |
Processor core | Skylake-SP |
Core stepping | H0 (SR37S) |
Manufacturing process | 0.014 micron |
Data width | 64 bit |
The number of CPU cores | 14 |
The number of threads | 28 |
Floating Point Unit | Integrated |
Level 1 cache size | 14 x 32 KB 8-way set associative instruction caches |
14 x 32 KB 8-way set associative data caches | |
Level 2 cache size | 14 x 1 MB 16-way set associative caches |
Level 3 cache size | 19.25 MB non-inclusive shared cache |
Physical memory | 768 GB |
Multiprocessing | Up to 4 processors |
Features | MMX instructions |
SSE / Streaming SIMD Extensions | |
SSE2 / Streaming SIMD Extensions 2 | |
SSE3 / Streaming SIMD Extensions 3 | |
SSSE3 / Supplemental Streaming SIMD Extensions 3 | |
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 | |
AES / Advanced Encryption Standard instructions | |
AVX / Advanced Vector Extensions | |
AVX2 / Advanced Vector Extensions 2.0 | |
AVX-512 / Advanced Vector Extensions 512 | |
BMI / BMI1 + BMI2 / Bit Manipulation instructions | |
F16C / 16-bit Floating-Point conversion instructions | |
FMA3 / 3-operand Fused Multiply-Add instructions | |
EM64T / Extended Memory 64 technology / Intel 64 | |
NX / XD / Execute disable bit | |
HT / Hyper-Threading technology | |
VT-x / Virtualization technology | |
VT-d / Virtualization for directed I/O [1] | |
TBT 2.0 / Turbo Boost technology 2.0 | |
TXT / Trusted Execution technology | |
TSX / Transactional Synchronization Extensions | |
Low power features | Enhanced SpeedStep technology [1] |
Integrated peripherals / components | |
Integrated graphics | None |
Memory controller | The number of controllers: 2 |
Memory channels per controller: 3 | |
Supported memory: DDR4-2400 | |
DIMMs per channel: 2 | |
ECC supported: Yes | |
Other peripherals | Ultra Path Interconnect (2 links) |
PCI Express 3.0 interface (48 lanes) | |
Direct Media Interface 3.0 (4 lanes) | |
Electrical / Thermal parameters | |
Thermal Design Power | 105 Watt |
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