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E5-26050V3 SR1YA
Details
| General information | |||
| Type | CPU / Microprocessor | ||
| Market segment | Server | ||
| Family | Intel Xeon E5-2600 v3 | ||
| Model number | E5-2650 v3 | ||
| CPU part numbers | CM8064401723701 is an OEM/tray microprocessor | ||
| BX80644E52650V3 is a boxed microprocessor | |||
| Frequency | 2300 MHz | ||
| Maximum turbo frequency | 3000 MHz | ||
| Bus speed | 9.6 GT/s QPI (4800 MHz) | ||
| 5 GT/s DMI | |||
| Clock multiplier | 23 | ||
| Package | 2011-land Flip-Chip Land Grid Array | ||
| Socket | Socket 2011-3 / R3 / LGA2011-3 | ||
| Size | 2.07" x 1.77" / 5.25cm x 4.5cm | ||
| Introduction date | 41890 | ||
| Price at introduction | |||
| S-spec numbers | |||
| Part number | ES/QS processors | Production processors | |
| QG99 | QGPL | SR1YA | |
| BX80644E52650V3 | + | ||
| CM8064401723701 | + | ||
| Unknown | + | + | |
| Architecture / Microarchitecture | |||
| Microarchitecture | Haswell | ||
| Platform | Grantley-EP | ||
| Processor core | Haswell-EP | ||
| Core steppings | M0 (QG99) | ||
| M1 (QGPL, SR1YA) | |||
| CPUID | 306F2 (SR1YA) | ||
| Manufacturing process | 0.022 micron | ||
| Data width | 64 bit | ||
| The number of CPU cores | 10 | ||
| The number of threads | 20 | ||
| Floating Point Unit | Integrated | ||
| Level 1 cache size | 10 x 32 KB 8-way set associative instruction caches | ||
| 10 x 32 KB 8-way set associative data caches | |||
| Level 2 cache size | 10 x 256 KB 8-way set associative caches | ||
| Level 3 cache size | 25 MB 20-way set associative shared cache | ||
| Physical memory | 768 GB | ||
| Multiprocessing | Up to 2 processors | ||
| Extensions and Technologies | MMX instructions | ||
| SSE / Streaming SIMD Extensions | |||
| SSE2 / Streaming SIMD Extensions 2 | |||
| SSE3 / Streaming SIMD Extensions 3 | |||
| SSSE3 / Supplemental Streaming SIMD Extensions 3 | |||
| SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 | |||
| AES / Advanced Encryption Standard instructions | |||
| AVX / Advanced Vector Extensions | |||
| AVX2 / Advanced Vector Extensions 2.0 | |||
| BMI / BMI1 + BMI2 / Bit Manipulation instructions | |||
| F16C / 16-bit Floating-Point conversion instructions | |||
| FMA3 / 3-operand Fused Multiply-Add instructions | |||
| EM64T / Extended Memory 64 technology / Intel 64 | |||
| NX / XD / Execute disable bit | |||
| HT / Hyper-Threading technology | |||
| VT-x / Virtualization technology | |||
| VT-d / Virtualization for directed I/O | |||
| TBT 2.0 / Turbo Boost technology 2.0 | |||
| TXT / Trusted Execution technology | |||
| Low power features | Enhanced SpeedStep technology | ||
| Integrated peripherals / components | |||
| Integrated graphics | None | ||
| Memory controller | The number of controllers: 2 | ||
| Memory channels per controller: 2 | |||
| Supported memory: DDR4-1600, DDR4-1866, DDR4-2133 | |||
| DIMMs per channel: 3 | |||
| Maximum memory bandwidth (GB/s): 68.3 | |||
| ECC supported: Yes | |||
| Other peripherals | Direct Media Interface 2.0 | ||
| Quick Path Interconnect v1.1 (2 links) | |||
| PCI Express 3.0 interface (40 lanes) | |||
| Electrical / Thermal parameters | |||
| V core | 0.65V - 1.3V | ||
| Maximum operating temperature | 78.9°C | ||
| Minimum power dissipation | 43 Watt (C1E state) | ||
| 13 Watt (C6 state) | |||
| Thermal Design Power | 105 Watt | ||
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